Northrop Grumman has been selected as one of the defense contractors eligible to compete for task orders valued at up to $25 billion under the US Defense Microelectronics Activity’s Advanced Technology Support Program V (ATSP V). The program is designed to accelerate the integration of domestically produced microelectronics into US military platforms and national security systems.
ATSP V serves as a fast-track contracting vehicle that enables the Department of Defense and other federal agencies to rapidly access advanced engineering and manufacturing solutions. Under the program, Northrop Grumman can respond to government requests for proposals within 30 days, with the goal of moving from proposal submission to contract award in approximately 80 to 90 days.
Structured as an indefinite-delivery, indefinite-quantity contract, ATSP V supports a wide range of microelectronics capabilities. These include next-generation semiconductor manufacturing, advanced packaging technologies, and emerging materials engineering critical to modern defense systems. Northrop Grumman joins nine other companies selected under the program, including Raytheon, L3Harris Technologies, General Dynamics Mission Systems, Leidos, HII Mission Technologies, Battelle Memorial Institute, DRS Network & Imaging Systems, Charles Stark Draper Laboratory, and Vertex Aerospace.
The ATSP V award builds on a broader US defense effort to strengthen domestic semiconductor production and secure trusted supply chains. In September 2023, GlobalFoundries received a decade-long contract with a $3.13-billion ceiling to provide trusted microelectronics for defense and federal agencies. More recently, in 2024, IBM secured a $576-million DMEA contract aimed at establishing a trusted commercial manufacturing enclave for sensitive military and national security semiconductor production.
